Fan-In Wafer/Panel-Level Chip-Scale Packages

Product Description

The Next Advanced Packages

Schematic drawing of a wafer-level chip-scale package (WLCSP) sample.

Packaging Part 6 - Wafer to Panel Level Packaging

Panel-Level debonding solutions from ERS enables Fan-out Panel-Level Package adoption – An interview with ERS electronic

Fan-Out Packaging Gets Competitive

Table 1 from Patent issues of embedded fan-out wafer/panel level packaging

Panel Fan-out Ramps, Challenges Remain

Fan-out Wafer- Panel Level Packaging - Fraunhofer IZM

InFO (Integrated Fan-Out) Wafer Level Packaging - Taiwan Semiconductor Manufacturing Company Limited

Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-out Chip Last Packages